PART |
Description |
Maker |
LFBGA-H FBGA |
Fine Pitch Ball Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
NP291-04812-2-AC-14680 NP291-04812-2-G4-BF NP291-0 |
Fine Ball Grid Array (FBGA, 0.75mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
CHC-CD0865A-01-10R0F CHC-CD0865A-01-10R0G CHC-CD08 |
Ceramic Ball Grid Termination Arrays
|
IRC - a TT electronics Company.
|
ECG2364 ECG2370 ECG2365 |
FAN AC 80X25 115/220V BALL, 18cfm FAN AC 80X25 220V BALL, 25cfm FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五(巴西)总裁| 12A条一(c)|47VAR
|
EPCOS AG
|
TSOP1530 TSOP1533 TSOP1536 |
Photo Modules for PCM Remote Control Systems Shrink Tubing; Tubing Size Diameter:1.5"; Shrink Ratio:2:1; Wall Thickness Recovered Nominal:0.049"; Material:Polyolefin; Color:Black; MIL SPEC:MIL-I-23053/4, Class 1
|
Vishay Telefunken Vishay Intertechnology,Inc.
|
FS1024 |
I.C. Socket, Pin Grid Array From old datasheet system
|
Advanced Interconnections
|
FGA272-638G FGA303-638G FGAX600-638G FGA304-638G F |
272 POS 1.27MM BGA ADAPTER BGA272, IC SOCKET 303 POS 1.27MM BGA ADAPTER BGA303, IC SOCKET 600 POS 1.27MM BGA EXTRACTION ADAPTER BGA600, IC SOCKET 304 POS 1.27MM BGA ADAPTER BGA304, IC SOCKET 168 POS 1.27MM BGA EXTRACTION ADAPTER BGA168, IC SOCKET 304 POS 1.27MM BGA EXTRACTION ADAPTER 255 POS 1.27MM BGA EXTRACTION ADAPTER 357 POS 1.27MM BGA ADAPTER 560 POS 1.27MM BGA ADAPTER
|
Advanced Interconnections, Corp. ADVANCED INTERCONNECTIONS CORP
|
CA-PLCC20-Z-M-T-01 |
Carrier Adapter 20 Position PLCC ZIF Socket with test points to mini-grid array interface. Pin mapping is 1:1.
|
Ironwood Electronics.
|
KEST-471BT KEST-471BW KEST-471SW KEST-472BT KEST-4 |
Sleeve or Ball Bearing
|
Kepont Electronics, Inc. Kepont Electronics, Inc...
|